Great News for China S.C: Single-Wafer TGV Cleaning Equipment Wins the Mass Production Order

China S.C is thrilled to announce a piece of great news that the in-house single-wafer TGV cleaning equipment has secured the mass-production order from one domestic top TGV company. It is the first time that the mature technology of single-wafer semiconductor cleaning is successfully applied to the manufacturing of ultra-thin glass substrate, shoring up the weak links in the domestic supply of key precision cleaning equipment for TGVs to accelerate the development of domestic advanced packaging equipment. 

The equipment adopts single-wafer cleaning design. With the process of micro-nano bubble water, it can clean both surface and edges of substrate to remove particles and organics in the vias and blind vias, achieving removing rate of over 99% for particles larger than 1 μm. In addition, this tool is equipped with non-contact Bernoulli gripper which can significantly reduce substrate breakage rate to under 10pmm and it can satisfy the processing requirement of 80μm ultra-thin glass. For the loading and unloading area, ISO Class 5 cleanliness control is applied to the separate zones, avoiding re-contamination to the substrates. 

Securing this order marks that the application of China S.C’s technology used in the wet-chemical equipment has successfully stretched into the field of TGV glass substrate from wafer and PCB, forming the brand-new domestic plan for ultra-thin substrate cleaning. It does not only demonstrate the key R&D capability of China S.C as one domestic semi-conductor company, but also provides critical support for achieving domestic development and control for the industrial chain of 2.5D/3D advanced packaging.