China S.C Wins Repeat Order for VCP Plating Equipment and Its High-End PCB Business is Securing More and More Orders

Recently, the fully automatic transfer-type VCP via filling plating equipment, which was developed independently by China S.C, has won the repeat order from its client. Meanwhile, China S.C also secured additional purchase orders for multiple VCP units, which are expected to be delivered and shipped successively in the fourth quarter of this year. 

The overall performance of the equipment leads the development with its high compatibility with wafers of various sizes and substrates of various thickness, excellent copper plating uniformity over 92% and dimple during via filling smaller than 3μm, meeting the manufacturing requirement for high-precision PCBs. 

Regarding the technical design, the equipment is equipped with multi-stage spray and eductor nozzles to effectively optimize the flow field in the tank. In addition, this equipment can keep operating with both DC and pulse power supplies and the parameters on both sides can be controlled separately so as to flexibly enable the main processes of filling via, through via, pattern plating and so on. 

With its stable and reliable operation, the equipment has consistently earned clients’ recognition. This repeat order marks a new phase, transitioning from initial single-point deployment to large-scale market adoption.