Recently, China S.C has successfully delivered the self-developed special high-precision mask inkjet printing equipment to domestic top c-Si PV company. This equipment is customized for the process of back patterning on the Poly layer of BC solar cells, which can achieve the low-cost mass production of precise patterning on the passivated layer of BC solar cells through replacing the traditional processes of laser grooving and dry film photoresist lithography.

Principle and Advantages
The equipment applies the wet chemical process of “Mask Inkjet Printing + HF Selective Etching + Strong Base Mask Removal” to overcome the drawbacks, including thermal damage, cumbersome procedures of dry film photoresist lithography and high costs brought by the traditional laser process. In addition, with the industrial piezo multi-channel printhead, the equipment can achieve a repeatability accuracy of ±2 μm for printed lines, an adjustable mask width of 50-200 μm, and a stable and controllable droplet diameter of 15-50 μm. Compatible with wafers of all sizes (including 182/210 wafers), it can operate on various back-contact cells, such as N-type TBC, IBC etc.
Climbing Mass Production Benefit
· Material utilization rate exceeds 95%, with mask consumable consumption reduced by over 50%;
· Eliminates multiple processes such as laser maintenance, dry film procurement, exposure, and developing;
· The equipment is compatible with existing wet chemical production lines and features a built-in AOI (Automated Optical Inspection) system, improving the overall yield by 0.2% to 0.5 %;
· Test results show improvement in both the cell’s open-circuit voltage and conversion efficiency;
This equipment delivery achieves seamless process integration between mask printing and upstream/downstream cleaning procedures, effectively filling the gap in domestic mass-production equipment for high-precision BC cell patterning. Moving forward, China S.C will target two key markets—c-Si BC cells and perovskite/silicon tandem cells—delivering integrated solutions that encompass equipment, functional ink, and comprehensive process packages.