S.C Achieves a Breakthrough! Micro-Nano Bubble Cleaning Equipment Successfully Exported, Unlocking a New Path for High-End Device Cleaning

Recently, S.C is proud to announce a major achievement: for the first time, S.C have applied micro-nano bubble water cleaning process to semiconductor/advanced packaging cleaning equipment, and this equipment has been successfully shipped overseas, delivering a brand-new solution for refined cleaning of high-end devices worldwide and demonstrating the strong technological capabilities of China’s semiconductor equipment enterprises.

As advanced packaging technologies evolve, semiconductor device structures are becoming increasingly sophisticated, and conventional cleaning processes can no longer meet high-end requirements. S.C have long been committed to innovation. By deeply integrating micro-nano bubble water technology with cleaning equipment, S.C have created products that combine high efficiency, environmental friendliness and precision, achieving a breakthrough in taking high-end equipment overseas.

The core advantages of the equipment can be broken down into two dimensions, precisely tailored to high-end requirements:

1. Highly Efficient and Eco-Friendly Cleaning

With micro-nano bubble water as the core medium, this equipment requires no chemical reagents, making it environmentally friendly. Leveraging the surface charge and low surface tension of micro-nano bubbles, it can precisely remove charged particles and clean deep into micro-structures. Combined with hydroxyl radicals generated from a specific gas source, it can efficiently remove organic contamination while preventing circuit pattern collapse.

2. High-Precision Cleaning Capability

This equipment is compatible with precision processes such as TSV and fine electrodes, enabling cleaning and etching of TSV products with a high aspect ratio (AR = 10:1). It can remove tiny particles at the 28nm level and metallic impurities, with a removal rate of over 99% for 50-100nm particles, and supports simultaneous cleaning of double-sided masks, improving efficiency and consistency.

Looking ahead, S.C will continue to uphold the philosophy of “technology leadership and excellence in quality”, deepen its presence in the field of advanced semiconductor cleaning, and continuously iterate functional water cleaning technology. With more innovative, highly efficient and environmentally friendly solutions, S.C will empower the upgrading of the global semiconductor industry, break through high-end cleaning technology barriers, drive the semiconductor cleaning field toward green and refined development, and contribute more “S.C” strength to the high-quality development of the global semiconductor industry.