S.C Makes an Appearance at the 2026 3rd Glass Substrate TGV and Panel-Level Packaging Industry Chain Summit Forum

From March 19th to March 20th, 2026, the 3rd Glass Substrate TGV and Panel-Level Packaging Industry Chain Summit Forum was grandly held in Suzhou, Jiangsu Province.Dr. Sheng Jiang, Chief Technology Officer of S.C (stock code: 300724.SZ), attended the forum with S.C’s cutting-edge technological achievements and delivered his keynote speech.

As the leading company in the industry of China’s semiconductor and electronics specialized equipment, Shenzhen S.C New Energy Technology Corporation relies on its tremendous technological strength and diversified equipment portfolio to actively advance the industrialized development of glass substrate and TGV technology.

During this forum, Dr. Sheng Jiang elaborated on the evolving process from the traditional 2D semiconductor packaging technology to 2.5D, 3D and fan-out packaging and other advanced packaging technologies around the development trend of advanced packaging and glass substrate technology. He also especially emphasized the critical role of heterogeneous integration in improving performance, reducing energy consumption and cost.

S.C developed various types of equipment on its own. For instance, the self-developed vertical and single wafer TGV glass substrate cleaning equipment is applied with the innovative cleaning technology using micro-nano bubble water, achieving green and deep via cleaning with high efficiency and precision. It greatly boosted the development of glass substrate packaging technology.

In addition, S.C’s new energy equipment covers all equipment used in the whole process, including wafer cleaning and etching, laser micromachining, electroplating (including VCP and gantry-type copper electroplating equipment). we can meet the precise manufacturing requirements of different materials and substrates with various sizes, ensuring the fine routing of PCB and formation of high-quality through vias.

In order to meet the cleaning requirements of large-sized glass substrates, the Company introduced the micro-nano bubble water cleaning technology. It utilized the great physical characteristic of micro-nano bubbles, including minimal diameter, high specific surface area, electrical charges on the surface and other advantages, to efficiently remove those particles on the substrate surface and in the through vias and blind vias, achieving thorough cleaning.

On the top of this, S.C also utilized the EUV pre-cleaning technology to efficiently remove organic pollutants on the surface of glass substrate. At the same time, we used the UV light to introduce hydrophilic functional groups, including hydroxyl group and carboxyl group, into the surface material structure, significantly improving the wettability. It built a great foundation for conducting next wet chemical cleaning processes.

With the rapid development of the semiconductor industry, the global semiconductor market is experiencing robust growth, driven particularly by emerging applications such as AI accelerators, AR/XR, and autonomous driving. As a result, its demanding for advanced packaging materials and technologies with high performance and low energy consumption is growing day by day. 

Through continuously optimizing designs, strengthening R&D and fostering industry-academia-research integration, S.C greatly improved its equipment throughput and process innovation capabilities. In addition, we are committed to reducing the energy per bit (EPB) and enabling sub-micron routing and miniaturization technology of through via, eventually propelling the self-reliance and industrial upgrading of China’s semiconductor packaging technology.