Great News! S.C’s First Fully Automatic Via Fill Plating PCB Equipment Line is Successfully Delivered

S.C (stock code: 300724.SZ) has achieved a critical leap in the printed circuit board field with the successful test and delivery of the fully automatic transfer-type via fill plating equipment independently developed by itself. It marks that the Company has made solid progress in the R&D of high-end equipment, injecting strong momentum into the localization process of high-end equipment in the PCB industry and empowering the PCB industry to stand on the top of the technology.

The fully automatic transfer-type via filling plating equipment line is 45 meters long. Its core features of “automation, high precision, high reliability” can perfectly match the requirements of the PCB industry’s transformation featured in high density, high precision and low carbon.

01 Substrate Compatibility 

It can produce circuit boards with multiple sizes from W510*L410mm to W510*L610mm and from the thickness of 0.05-2.00mm, meeting all requirements of various types of PCB. These products can be applied in many fields of consumer electronics, automatic electronics and communication equipment, improving productive compatibility;

02 Chucking Precision

The minimum chucking precision is 5-8 mm, adaptable to small-scale and high-precision products, ensuring substrate stability, obstruction reduction and improvement of electroplating uniformity;

03 Control of Plating Solution

The plating solution in the chemical tank and copper tank will be added in accordance with the covering and on an hourly basis respectively, ensuring the stable solution concentration, precise solution control and uniform plating quality;

04 Electroplating Accuracy

S.C invented its own plating rack applied in the pilot line, achieving the copper plating over 93%. The difference between mean values of copper plating on both sides is less than 0.2 µm, improving the stability of circuit pattern etching and signal transmission;

05 Control of Copper Plating

The process of high aspect ratio 1:1 via fill plating is applied to remove the industrial bottleneck of “uneven plating and hole voids”, achieving the dimple less than 3μm and the improvement of PCB continuity, cooling and mechanical performance. It matches the HDI high-end requirements.

06 Automatic Management and Control

It is equipped with a smart inspection system which can automatically check plating racks for clamping point resistance and can make warning for abnormalities and finish the closed-loop treatment. In this way, the parameter deviation can be minimized and the process will be stabler and traceable. In addition, the qualified rate and efficiency are improved while the cost is reduced, meeting the requirement of PCB smart upgrading.

07 Precise Process Closed-Loop Control

With the independent control of pump, the millisecond-level monitoring and regulation of current density is applied, ensuring the optimal operation of equipment and improvement of compatibility and reliability. It is also compatible with various high-end processes of PCB and MSAP.

08 High Cleanliness Design

External environmental isolation enclosure has reached the standards of semiconductor level. It reduces impurities through sealing purification technology and improves yield through lowering the defect rates, empowering the high-end PCB technology to break the overseas tech monopoly to achieve localized mass production.

Relying on its core technologies which can also be applied in the PCB industry, S.C earns its advantage of efficiently entering the high-end PCB equipment market and has thus gained acknowledgement of the leading PCB companies. The successful delivery of the first fully automatic via fill plating equipment line does not only represent the fruits harvested by the Company through its efforts, but also the critical implementation of the multi-engine driving development strategy of “lithium battery+semiconductor+PCB”. It has filled the gap in technology of domestically manufacturing the high-end PCB equipment, optimizing the product lineup.

In the future, upholding the philosophy of “leading technology, excellent quality”, S.C continuously delves into the field of high-end PCB equipment and advances the technological iteration and the product innovation through relying on its great R&D efforts and core technological team. In this way, China’s PCB sector can be propelled to make the leap from a “manufacturing giant” to a “manufacturing powerhouse”, fulfilling the mission of domestic substitution of PCB equipment.