Title Sponsor of ZHPCA's 10th Anniversary Gala — S.C Introduces Domestic High-Aspect-Ratio Through-Hole Plating Solution

On July 31, S.C served as title sponsor of the first membership meeting of the third session of the Zhuhai Printed Circuit Association (ZHPCA) and its 10th anniversary celebration. Ms. Ren Jinzhi, R&D Director of S.C, delivered a keynote speech at the event, sharing the spray-suction pulsed VCP (Vertical Continuous Plating) equipment, which overcomes the industry challenge of ultra-high-aspect-ratio plating for high-end AI PCBs. 

The need for AI computing power is now driving an explosive surge in demand for high-end PCB. The annual output value of the AI PCB market is expected to grow substantially from 2024 to 2029, and through-holes with an ultra-high aspect ratio of 30:1 have become standard for AI server backplanes and IC substrates. However, conventional plating equipment lacks sufficient throwing power, which tend to cause underplating inside holes, uneven copper thickness, and excessive high-frequency signal loss, severely constraining mass-production yield.

S.C has pioneered a spray-suction dual-direction pressure-differential flow field technology. By creating a pressure differential between spray pipes and suction pipes, it accelerates plating solution flow inside microvias, raising in-hole mass transfer efficiency by 30%–40%, effectively mitigating concentration polarization and eliminating the “dog-bone effect”. Measured data show that at AR=20:1, through-hole TP is above 93%; at AR=30:1, through-hole TP is above 85%; the range of copper thickness on the panel surface is less than 3 µm, with uniformity exceeding 92%. Domestic plating chemicals perform comparably to imported chemicals, with no significant difference.

Outstanding Advantages in Equipment Delivery and O&M

S.C's plating equipment has a monthly capacity of 50 units, with a lead time of 3 months for complete machines, and can be installed and commissioned within 2 weeks after arrival on site. The equipment covers pulse/DC VCP models and is compatible with substrates of 0.05–4 mm. Fully automated production and one-click switching of process recipes make it suitable for diverse high-end PCB production lines.

This title sponsorship of ZHPCA's 10th anniversary event is an important step by S.C to deepen industrial collaboration in the Greater Bay Area. In the future, S.C will continue to work with industry associations to deliver domestic high-end plating equipment and process solutions, helping the Zhuhai PCB industrial chain break through technical bottlenecks, seizing the growth opportunities of the AI industry, and driving the independent, high-quality development of the electronic circuit industry in the Greater Bay Area.