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4-chamber single wafer horizontal electroplating process equipment

PRODUCTS AND SERVICES > Semiconductor Equipment Series > 4-chamber single wafer horizontal electroplating process equipment
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4-chamber single wafer horizontal electroplating process equipment

  Functional application  

·RDL、Bumping、TSV.

·Uniformity within the tablet: < 4%

·Inter-slice uniformity: < 3%

·Repeatability: < 3%

·COP: < 10µm




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