Horizontal continuous electroplating equipment

  Features  

·Silicon wafers do not require the installation of carriers and are transported horizontally and continuously.

·The entire machine is fully covered with PP fireproof materials, enhancing the safety level of the equipment.

·The special copper tank and pipeline design require less chemicals and also reduce the energy consumption of the pump.

·The unique spray water washing module ensures full coverage of the battery cells during cleaning.

·Flexible cathode contact silicon wafer electroplating is more stable.

·The process control is carried out by using an IPC industrial control computer in combination with a PLC, which can perform automatic or manual modes and can be matched with an automatic loading and unloading machine for intelligent production.

·Self-developed software design, user-friendly operation interface, real-time production and machine operation information, Recipe editing function, complete Log recording function, modular software design, meeting customers' customized requirements.